xMEMS extends micro cooling fan-on-a-chip tech to AI data centers

XMEMS LaboratoriesAn advanced pioneer of monolithic meme-based chips, announced that the innovative μcoling fan-on-a-chip platform will expand the AI ​​data centers.

These micro fans are all silicone devices from the micro-electromechanical system of the company made of silicone chips of small mechanical structures.

XMEMS, this is the industry’s module in-module that the active heat management solution will deliver high-performance optical transmitters, he said.

First prepared for compact mobile devices, XMEs μCooling now provides target, hyper-
Localized active cooling for tight, heat-thermal environment within 400g, 800g and 1.6t
Optical TransCelarvers – Next-Gener is critical in the AI ​​infrastructure, but an undeclosed category.

Unlike the usual cooling approaches with high power (kilowatt) processor and GPUs, μCooling targets
Small, heat focuses on stressful components, which cannot be obtained from large-scale cooling systems
Optical Transceiver DSPs operating at 18W TDP or higher levels. These components provide thermal
As the data prices passed as a scale, transition performance and reliability are difficulties and increases.

Xmems’ monolithic Memes fan strikes a fictitious, continuous flow in the standard silicone processes
Silent, vibration free high-speed air beans and a fairly active cooling solution is quite and thin
to access the transmission module. The thermal modeling shows that μCooling can be deleted
5W localized heat reduces more than 15% of the DSP operating temperature and heat resistance
More than 20%, higher resistant transmission capability, improved signal integrity and extension
Module life.

Μcooling is the main innovation in the design system, a special, isolated airflow
The transceiver is a combined but physically separated channel to internal heat sources
From optical road and basic electronics. This architecture ensures the remaining optical components
Protected from dust or pollution, signal clarity and transition default still protects
Delivery of effective cooling performance.

“The data center requires a speedy scale with AI workload, thermal swollen emerges
In the component level – especially sealed, in the optical modules of power tight and space
In restrictions, “Vice President of Marketing in XMEs, Mike Houshaner,” μCooling Optics or Form factor is placed in a private order to solve the actual module with active cooling without any concessions. “

Market analysts predict strong growth in high speed optical connection with Dell’oro Group Projection
More than 35% of more than 35% of 2028 to increase in Cabry and 1.6t and 1.6t transmission. On the scale of these modules
Performance and power, turns into a critical obstacle to accept cooling problems.

μCooling’s solid periodic, Piezomems design is no engine, moving bearings and mechanical
To ensure, wear, wear, to provide freedom and high-volume production. Its a compact footprint, like
9.3 x 7.6 x 1.13mm and expandable architecture makes it ideal for modular placement between a a
The CSFP-DD is a wide range of OSFP and future acceptable and pakchamed optics.

Now the XMEMS in XMCooling, which serves both mobile and data center markets, results in its
A solid state heating renewal to unlock the next wave of high performance electronics.
For more information on xmems and μcooling heat rolling solution, visit XMems.com.

The XMEMS laboratories established in January 2018 established a Piezomems platform. In the semi-conducting meme, monolithic meme speakers, wireless headphones, new voice experiments, revolutionary sound experience, the widening of the revolutionary audio performance, invented the speakers of monolithic, monolithic meme. The XMEs Piezomems platform also expanded to produce the world’s first μCooling fan in a chip on smartphones and other thin, performance-oriented devices.

XMEs have more than 230 patents in the world for technology in the world. Tech has been in business for many years. First heard about them In 2020, Joseph Jiang spoke about the technology behind the plugs that activated the XMEMS CEO, chip-based dynamics. They now send them to the market. Meanwhile, Xmems were also announced Micro cooling solutions for “a chip” for electronics.